Products
Aluminum nitride (AlN) filler
Aluminum nitride is an inorganic material having both high thermal conductivity and insulating properties. It has the almost same thermal expansion coefficient as silicon semiconductor and has resistance to halogen gas plasma used in semiconductor manufacturing process. Utilizing its characteristics, it is used for components for semiconductor manufacturing equipment in silicon wafer front-end process, or electrical insulating heat dissipation substrate for power semiconductors and high power LEDs. Since it has about 9 times thermal conductivity compared with conventional heat dissipating material, it is expected as a high heat dissipation filler which improves the thermal conductivity of resin.
Product overview *Some products under development
| Generic names | Aluminum nitride (AlN) filler |
|---|---|
| Chemical formula | AlN |
| Packing / shipping method |
10-kilogram cans |
| General applications | High thermal conductivity filler, etc. |
Special characteristics
- Various particle size lineup
- Achievement of high filling and high thermal conductivity
- Reduction of agglomerated particles (top cut)
- High resin adhesion and High reliability
- Improved compound performance
Properties of Aluminum nitride (AlN) filler
*Values are representative, not guaranteed.
HF-01D
HF-20
HFS-80
