High-purity fused spherical silica "EXCELICA"

Fumed Silica

Generic names Silicon dioxide (High-purity fused spherical silica)
Product name EXCELICA
Packing / shipping method Flexible containers, paper bags
Chemical formula SiO2

Product overview

EXCELICA is fused synthetic spherical silica produced by gas phase reaction. Particle diameter ranges from the submicron level to 100 microns. Special products combining blends and larger particle cuts are also available according to specific application.

Applications

  • Solid and liquid encapsulants for semiconductors
    EXCELICA is used to reduce thermal expansion, reduce hygroscopicity, improve thermal conductivity and increase the strength of semiconductor encapsulant, including encapsulant for DRAM.
  • Precision adhesive
    EXCELICA is used to reduce shrinkage from hardening and reduce thermal expansion with adhesives for precision placement of optical lenses for DVD optical pickups.
  • Films
    EXCELICA is used for antiblocking wrapping films and other uses.
  • Transparent quartz materials
    EXCELICA is used as a raw material for transparent quartz materials produced using the slip casting method. High purity

Characteristics

EXCELICA is produced in a closed system using high purity ingredients, resulting in silica with very few impurities such as radioelements, heavy metal elements, or ionized elements. The content of uranium or thorium, which emits alpha radiation causing semiconductor memory malfunctions, in EXCELICA is less

For more information:

Silica & Derivatives Sales Department, Specialty Products Business Division
TEL: +81-3-5207-2532
FAX: +81-3-5207-2576

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