SHAPAL™ is Tokuyama's line of ceramic products, which are made by sintering aluminum nitride powder. SHAPAL™ has excellent thermal conductivity, strong resistance to halogen gas plasma, and a coefficient of thermal expansion similar to silicon. These properties are made use of in a wide range of applications, including components that require effective heat dissipation and components for semiconductor production equipment.

Product overview

Generic names	Aluminum nitride ceramics
Chemical formula	AlN
Special properties	High purity High rate of thermal conductivity Excellent electrical insulation High degree of strength High corrosion resistance Transparent Strong resistance to halogen gas plasma Low thermal expansion properties
General applications	Power devices LD and LED heat sinks Semiconductor production equipment
Product lineup	SHAPAL™ SH-30 Ceramics with a high level of strength and a thickness of 1 millimeter or thinner Applications: Power devices; LD and LED heat sinks SHAPAL™ SH-15 Ceramics with high thermal conductivity and a thickness of 2 millimeters or thinner Applications: Semiconductor production equipment; various other usages SHAPAL™ SH-50 Ceramics with a high degree of purity (free of auxiliary additives) and a thickness of 2 millimeters or thinner Applications: Semiconductor production equipment; prevention of internal pollution to machinery from metallic impurities; various other usages

Properties			Units	SH-30	SH-15	SH-50
General properties	Density		g/cm2	3.34	3.33	3.24
Electrical properties	Volume resistivity		Ω/㎝	8.4×1013	1.1×1014	3.1×1013
	Dielectric constant	RT,1MHz		9.1	9.1	8.9
	Dielectric loss	RT,1MHz		2.5×10-4	3.0×10-4	2.6×10-4
	Withstand Voltage		kV/mm	36.7	31.3	18.7
Thermal properties	Thermal conductivity	20oC	W/(m.k)	174	184	86
Mechanical properties	Bending strength		Mpa	511	357	356

Related Materials

• Comparison of performance between Aluminum Nitride and other materials for substrate