Our high-purity, non-porous, and perfectly spherical fillers–including silica, silica-titania composite oxide, and silicone fine particles–offer excellent dispersibility and are available in a variety of particle sizes.

These fillers have been used as functional additives for high-performance applications, including advanced underfill materials for semiconductor encapsulation, liquid resins, precision adhesives, high-performance films, and ceramic precursors. They help optimize properties such as electrical insulation, thermal expansion, mechanical strength, elasticity, moisture permeability, and refractive index–making them ideal for advanced material design.