Silica SILFIL™
SANSIL™
EXCELICA™

About About Silica

Overview

With our proprietary synthesis technology and ultra-high-purity raw materials, we offer perfectly spherical silica particles with SiO₂ purity exceeding 99.9%. Our silica contributes to the advancement of cutting-edge materials across a wide range of industries.
Our silicas feature an amorphous structure, as it is synthetically produced using Tokuyama’s proprietary process. Compared to natural crystalline silica, which is classified as carcinogenic, amorphous silica is considered safe. You can use our silica with confidence across a wide range of applications.

Crystalline Silica

結晶質シリカ|Crystalline Silica
  • Crystalline silica is a form of silicon dioxide(SiO₂) arranged in a regular, repeating pattern.
  • Designated in 2022 under Japan’s Industrial Safety and Health Act as a newly regulated carcinogenic substance, indicating a high level of hazardous potential.

Amorphous Silica

結晶質シリカ|Crystalline Silica
  • The atoms are arranged in a disordered manner and do not form a crystalline structure.
  • Compared to crystalline silica, amorphous silica is generally regarded as less hazardous to human health. All silica products by Tokuyama are amorphous.

Basic Physical Properties

SILFIL™

  • Manufactured using dry process (combustion method)
  • Spherical amorphous silica with mean particle size ranging from 0.1-0.4μm
  • Sharp particle size distribution with low content of coarse particles.
  • High purity with ultra-low levels of impurities.
  • Ultra-Low Alpha Silica
結晶質シリカ|Crystalline Silica
SILFIL™ NSS-3N

Interval frequency

結晶質シリカ|Crystalline Silica Frequency [vol.%] Particle size [μm]

Cumulative frequency

結晶質シリカ|Crystalline Silica Frequency [vol.%] Particle size [μm]

Measured by centrifugal sedimentation method.

SANSIL™

  • Manufactured using wet process (sol-gel method)
  • Spherical amorphous silica with mean particle size ranging from 0.1–1.5 μm
  • Exceptionally sharp particle size distribution with low content of coarse particles.
  • High purity with minimal impurities
  • Ultra-Low Alpha Silica
結晶質シリカ|Crystalline Silica
SANSIL™ SS-04

Interval frequency

結晶質シリカ|Crystalline Silica Frequency [vol.%] Particle size [μm]

Cumulative frequency

結晶質シリカ|Crystalline Silica Frequency [vol.%] Particle size [μm]

Measured by laser diffraction scattering method.

EXCELICA™

  • Manufactured using dry process (fusion method)
  • Spherical amorphous silica with mean particle size ranging from 2–40 μm
  • Broad particle size distribution
  • Available in grades with coarse particle cut
  • Due to its highly pure raw material, it contains fewer impurities than natural fused silica
  • Ultra-Low Alpha Silica
結晶質シリカ|Crystalline Silica
EXCELICA™ UF-320

Interval frequency

結晶質シリカ|Crystalline Silica Frequency [vol.%] Particle size [μm]

Cumulative frequency

結晶質シリカ|Crystalline Silica Frequency [vol.%] Particle size [μm]

Measured by laser diffraction scattering method.

View grade details
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Grade D50(μm)* BET surface area(m 2/g) Fe(ppm) Al(ppm) Na(ppm) K(ppm) Cl(ppm) U(ppb) H2O(%)
SILFIL™ Combustion method NSS-5N 0.1 50.0 <1 <1 <1 <1 <1 <0.1 <0.2
NSS-4N 0.12 40.0 <1 <1 <1 <1 <1 <0.1 <0.2
NSS-3N 0.15 30.0 <1 <1 <1 <1 <1 <0.1 <0.2
NSS-24D 0.24 15.0 <1 <1 <1 <1 <1 <0.1 <0.2
NSS-40D 0.38 9.0 <1 <1 <1 <1 <1 <0.1 <0.2
SANSIL™ Sol-gel method SS-01 0.1 24.0 <10 <10 <1 <1 <1 <0.1 <0.2
SS-03 0.3 11.0 <10 <10 <1 <1 <1 <0.1 <0.2
SS-04 0.4 7.0 <10 <10 <1 <1 <1 <0.1 <0.2
SS-07 0.7 4.0 <10 <10 <1 <1 <1 <0.1 <0.2
SS-10 1.0 3.0 <20 <20 <1 <1 <1 <0.1 <0.2
SS-15 1.5 2.0 <20 <25 <1 <1 <1 <0.1 <0.2
EXCELICA™ Fusion method SE-1 2.0 14.5 <5 <1 <1 <1 <1 <0.1 <0.5
SE-8 10.0 1.5 <5 <1 <1 <1 <1 <0.1 <0.1
SE-15 17.0 1.0 <5 <1 <1 <1 <1 <0.1 <0.1
SE-30 30.0 0.7 <5 <1 <1 <1 <1 <0.1 <0.1
SE-40 38.0 0.6 <10 <1 <1 <1 <1 <0.1 <0.1
SE-15K 16.0 1.0 <5 <1 <1 <1 <1 <0.1 <0.1
SE-30K 25.0 0.8 <5 <1 <1 <1 <1 <0.1 <0.1
UF-303 2.2 2.8 <15 <5 <1 <1 <1 <0.1 <0.1
UF-305 2.7 2.1 <15 <5 <1 <1 <1 <0.1 <0.1
UF-310 3.0 2.0 <15 <5 <1 <1 <1 <0.1 <0.1
UF-320 3.5 1.6 <15 <5 <1 <1 <1 <0.1 <0.1
UF-345 3.5 1.6 <15 <5 <1 <1 <1 <0.1 <0.1
UF-725 7.0 1.6 <5 <1 <1 <1 <1 <0.1 <0.1

This table represents typical values and is not guaranteed.
Please note that some listed products are under development. For specific grade inquiries, feel free to contact us.
*SANSIL™ and EXCELICA™ are measured using the laser diffraction method. SILFIL™ is measured using the centrifugal sedimentation method.

Close grade details

Point

Surface treatment grades

Appropriate surface treatment improves compatibility with resins, suppresses silica agglomeration, and enables uniform dispersion within the resin matrix. As a result, improvements in viscosity behavior and physical properties can be expected.

Image of the Silica Surface

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Examples of surface treatment agents

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Solvent dispersibility

  • 〇:Easy
  • △:Conditional
  • ×:Hard
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Grade name Water Acetone Ethanol Ethyl Acetate MEK* Toluene
Untreated Silica × ×
Trimethylsilyl-treated silica ×
Phenyl-treated silica ×
Epoxy-treated silica
Phenylamino-treated silica × ×

*Methyl Ethyl Ketone

Cross-sectional view of cured epoxy resin filled with silica and resin viscosity

Appropriate surface treatment significantly enhances adhesion to resins.
For example, when epoxy-treated silica is incorporated into an epoxy resin, the silica bonds closely with the resin upon curing, resulting in excellent adhesion. This technology contributes to improved bonding strength and durability, making it suitable for a wide range of applications.

Untreated Silica

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SANSIL™ SS-10(D50=1.0μm)

Treated Silica

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Epoxy treated SANSIL™ SS-10(D50=1.0μm)
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The values are relative, using SS-10 (untreated surface) viscosity as the reference (100%).

This data represents typical values and is not guaranteed.

Formulation
Epoxy resin with curing agent and silica
Silica content
60wt.%
Shear rate
20s-1
Measurement Temperature
25℃

Capillary flow testing

Compared to untreated silica, surface-treated silica shows significantly faster gap penetration in epoxy resin.
Achieve 3 times* faster gap filling with epoxy treated silica.
*Penetration time for a length of 2 cm

Penetration rate testing

28.6x speed

Capillary flow(3 hours after mixing)

隙間浸透性(混練後3h経過) Penetration length [cm] Penetration time [s]

This data represents typical values and is not guaranteed.

Composition
Epoxy resin with curing agent and silica
Silica content
60wt.%
Capillary flow
Dimensions: 1.0 cm (width) × 2.0 cm (length) × 30 μm (thickness)
Measurement Temperature
110℃

Viscosity reduction achieved through particle formulation

By combining spherical silica particles of different sizes, resin viscosity can be reduced compared to using a single grade. This enables higher filler loading, contributing to improved performance and broader application potential.

1. Formulation

SILFIL™ with mean particle sizes of approximately 380 nm and 150 nm are blended at a mass ratio of 9:1.
Phenyl-treated silica is used

Mass ratio

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Phenyl-treated
NSS-40D(D50=0.38μm)
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Phenyl-treated
NSS-3N(D50=0.15μm)

Formulation image

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Mixing multi-sized SILFIL™ in a 9:1 mass ratio.

2. Viscosity Measurement

  • ①:Phenyl-treated NSS-40D (D50=0.38μm)
  • ②:Phenyl-treated NSS-3N (D50=0.15μm)

At 25°C

隙間浸透性(混練後3h経過)

At 110°C

隙間浸透性(混練後3h経過)

All data are relative values, compared to the viscosity of sample ① measured at 25°C (set as 100%).

This data represents typical values and is not guaranteed.

Composition
Epoxy resin with curing agent and silica
Silica content
60wt.%
Shear rate
1s-1
Measurement Temperature
25℃, 110℃

Applications

Semiconductor encapsulant

Insulation enhancement, Mechanical strength improvement, CTE* reduction, Viscosity adjustment

*CTE (Coefficient of Thermal Expansion)

Adhesive

Insulation enhancement, Mechanical strength improvement, CTE* reduction, Viscosity adjustment

*CTE (Coefficient of Thermal Expansion)

Film

Anti-blocking performance, Slip property improvement, Heat resistance, Adhesion enhancement

Quartz, ceramics, etc.

High-purity powder material for sintering applications

* The values and images are examples based on our tests and do not guarantee quality.

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