Aluminum nitride is an inorganic material that combines high thermal conductivity with excellent electrical insulation.
It possesses a thermal expansion coefficient comparable to silicon semiconductors and exhibits resistance to halogen gas plasma used in semiconductor manufacturing processes.
Leveraging these properties, it is used in insulating heat-dissipating substrates for power semiconductors and high-power LEDs, as well as components for semiconductor manufacturing equipment used in the front-end process of silicon wafers. With approximately nine times the thermal conductivity of conventional thermal conductive fillers, it is anticipated as a high-thermal-conductivity filler to enhance the thermal conductivity of resins.
Achieving thermal conductivity
Heat, like electricity, travels along the path of least resistance. Therefore, connecting thermal conduction paths is crucial for achieving high thermal conductivity. Using only one type of spherical particle makes it difficult to increase the packing density and establish contact between particles, making it hard to achieve high thermal conductivity. Here, adding small spherical particles fills the gaps between particles, increases the packing density, and creates contact points between fillers, thereby enhancing thermal conductivity. Furthermore, using polyhedral particles increases the contact points between fillers, enabling the achievement of even higher thermal conductivity.
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Particle size distribution control+D28
We offer fillers in a diverse range of sizes from 1μm to 120μm with controlled particle size distribution. By combining these sizes, you can achieve resin materials with enhanced fillability and high thermal conductivity.
* Figures and images are examples based on our testing and do not guarantee quality.
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Versatile surface treatments
A variety of surface treatments are available to improve the water resistance—a weakness of aluminum nitride—and enhance its compatibility with various resins.
To enhance resin fillability, we offer fillers with a wide range of particle sizes from 1μm to 120μm. Combining these particle sizes enables the creation of resin materials with high thermal conductivity and excellent fillability.
Furthermore, by controlling the particle size distribution for each filler size, we improve dispersibility and ensure excellent processing characteristics.
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a Treatment: For silicone resin system、
c Treatment: For epoxy resin system、
h Treatment: For epoxy and acrylic resin systems、
FAQ
Frequently Asked Questions
Q1
What should I do if the filler does not mix, the filler filling rate does not increase, the resin with the filler is not as fluid (viscosity increases), or the thermal conductivity does not rise to the target?
A1
When using fillers with multiple particle sizes in the kneading of resins and fillers, it is generally said that the mixability is improved by sequentially kneading the fillers with smaller particle sizes. Proper surface treatment can improve compatibility with resins and improve viscosity properties. In addition, by improving the familiarity with the resin by surface treatment, the kneading performance is better than that of untreated. As a result, high filling rates can be achieved and thermal conductivity can be improved.
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Q2
Please tell me about water resistance.
A2
Comparing HF-01D (untreated) and HF-01Da (surface treated), the surface treatment product has inhibited hydrolysis.
AlN moisture resistance
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Citations: Kuramoto, Ceramics, 1987, 22, 29-4.
Surface treatment suppresses the hydrolysis of aluminum nitride
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Q3
What are the storage conditions and storage period?
A3
Store in a dry, well-ventilated cold place. In addition, when storing for a long time, it is desirable to replace the container with dry nitrogen gas to prevent decomposition by moisture in the air. (*Excerpted from SDS)
Q4
The balance between thermal conductivity and fluidity is not achieved.
A4
It is considered to have an appropriate formulation.
Please refer to the diagram below.
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Q5
Do you have a low alpha filler?
A5
Low alpha-ray development grade (HF-E01D) is also available.
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Q6
I don't know the appropriate grade (particle size and surface treatment) or the amount of mixture.
A6
You can choose the type of particle size and surface treatment depending on the application, the type of resin, and the thickness of the resin.
a Treatment: For silicone resin system
c Treatment: For epoxy resin system
h Treatment: For epoxy and acrylic resin systems
The range of particle sizes ranges from 1 μm to 120 μm, and customization is possible such as surface treatment and top cut according to the resin.
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It is possible to select the particle size according to the BLT. By combining multiple fillers with different particle sizes, it is possible to form a heat conduction path.
