Hexagonal boron nitride (h-BN) exhibits excellent electrical insulation properties and maintains stable insulation performance even under high-voltage environments. Its volume resistivity is as high as 1013–1016 Ω·cm, and it also offers outstanding heat resistance, ensuring minimal degradation of insulation performance at elevated temperatures.
Thanks to its unique combination of high thermal conductivity and high electrical insulation, h-BN is ideal for applications requiring both efficient heat dissipation and electrical safety.
feature02
Characteristics not found in other fillers
Hexagonal boron nitride (h-BN) exhibits high in-plane thermal conductivity of approximately 200–400 W/m·K due to its layered crystal structure. In contrast, the through-plane thermal conductivity is only a few W/m·K, allowing flexible design of heat dissipation direction.
While maintaining excellent electrical insulation, h-BN enables efficient thermal management and contributes to reduced component temperatures and improved reliability in power devices, thermally conductive insulating components, and high-performance fillers for resins and rubber.
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*Various figures and data are representative and are not guaranteed.
Case
Case Study
Development of High-Performance Thermally Conductive Insulating Sheets
Our BN powder is synthesized using a proprietary reduction–nitridation process, enabling unique particle shape control. We offer two grades: S03, consisting of low-aspect-ratios primary particles that overcome the limitations of conventional platelet BN and enhance resin packing efficiency; and DF-20, an agglomerated grade designed to deliver high thermal conductivity.
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*Epoxy resin sheet (thickness 120μm)
S03Synthesis of h-BN by reductive nitriding method.
Low-aspect-ratios praimary particles that grown in the thickness direction
Easy to disperse down to single particles (6~8 μm), low resin filling viscosity
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*After ultrasonic dispersion
DF-20Synthesis by reduction nitriding method.
High intensity of agglomeration, agglomeration particles do not break after dispersion
When using DF-20 filled resin sheet It has high thermal conductivity and dielectric strength of more than 15 W/m·K
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*After ultrasonic dispersion
FAQ
Frequently Asked Questions
Q1
I don't know the appropriate grade (particle size and surface treatment) or the amount of mixture.
A1
If you want to achieve both high thermal conductivity and withstand voltage, we recommend that you choose DF-20 (flocculation). If you want to focus on withstand voltage or apply it to thin film sheets of 100 μm or less, we recommend S03 (wall thickness single particle).
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*Epoxy resin sheet (thickness 120μm)
Q2
Are there any concerns about impurities (conductive foreign objects)?
A2
DF-20 is the highest-purity grade among Tokuyama’s BN powder grades. DF-20 contains an extremely low total number of black particles, which are a cause of insulation defects and appearance defects.
Q3
Please tell us how it differs from other companies' products.
A3
Tokuyama's BN powder is of very high purity, with extremely small amounts of impurities controlled. It is characterized by very little moisture, B2O3, carbon and oxygen remaining inside the BN particles on the surface of BN particles.
