Automotive
- Inverter
- Power Module
- ECU
High thermal conductivity and insulation
Changing thermal conductivity
High Thermal Conductive Filler
Versatile
Widely used in diversified application & market
High Thermal Conductive Filler
Smartphones
- Processor
- Camera
- Battery
Servers
- Processor
- Memory
Tele communication & Data communication
- Processor
- Power Amplifier
- Optical Module
Suitable for thermal management of
electronic devices
Thermal conductive fillers are utilized as thermal conductive sheets, thermal conductive gap fillers, and substrates to where thermal management is crtical, such as semiconductor devices like CPUs and ICs, optical components in telecom & datacome, batteries and inverters surrounding in electric vehicles. Thermal conductive filler gives consistent performance even under high temperature enviroment, so applied to diverisified cutting edge technology field.
General purpose
General application of
thermal conductive fillers
Thermal interface materials with thermal conductive fillers
encourage heat dissipation for semiconductor chip surroudings.
Our filler
Tokuyama’s two types of
high thermal conductivity fillers
Tokuyama offers two types of fillers: aluminum nitride fillers and boron nitride fillers.
Tokuyama can engineer powder properties upon cusotmer's requirment.
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* Figures and images are examples based on our testing and do not guarantee quality.
Type
Product overview
Products
Product Overview
AlN filler (high purity aluminum nitride filler)
- Features
- High thermal conductivity (more than 9 times that of alumina), high insulation, thermal expansion close to silicon
- Uses
- Fillers for heat dissipation resin materials
- CAS Number
- 24304-00-5
BN Filler (High Purity Boron Nitride Filler)
- Features
- High heat dissipation, high insulation, high purity
- Uses
- Fillers for heat dissipation resin materials
- CAS Number
- 10043-11-5
* Figures and images are examples based on our testing and do not guarantee quality.