Tokuyama Corporation (hereinafter referred to as "the Company" or "Tokuyama") will open a mass production examination facility at its Center for Commercialization of Advanced Technology in Yanai City, Yamaguchi Prefecture. The facility is scheduled to commence operations in April 2023. High heat dissipation aluminum nitride fillers are used in the insulating and heat dissipating substrates in power semiconductors and high-performance LEDs as well as the materials used in semiconductor manufacturing equipment.

Due to the trend toward miniaturization and higher density mountings in electronic devices in recent years, the load placed on devices that control power consumption has been increasing. The increases in the amounts of heat generated have meant that heat dissipation measures have become an urgent issue, as there is a risk of impeding the performance and shortening the service lives not only of the devices but also of the electronic equipment in which they are installed.

The Company has long been engaged in the business of aluminum nitrides, materials that possess high heat dissipation properties. Ranging from aluminum nitride powder to granules and SHAPAL™ ceramic products, which are made by sintering aluminum nitride powder, we have been developing products that are tailored to their applications.

Aluminum nitride is an inorganic material that possesses both high thermal conductivity and insulating properties. The Company's newly developed aluminum nitride filler has approximately nine times the thermal conductivity of conventional heat dissipating fillers, and is thus expected to be a high heat dissipating filler that improves the thermal conductivity of resins. As the aluminum nitride filler that we are examining for mass production at this time has excellent fluidity when filling in resin, it is possible to increase the amount of aluminum nitride filler inside the resin, and the thermal conductivity of the resin is thereby significantly improved.

Under its Medium-Term Management Plan 2025, the Company is aiming to transform its business portfolio into electronics, healthcare, and the environment while planning to accelerate business development in the field of electronic materials, including this business. Together with the advances being made in next-generation communications (5G), IoT, advanced driver-assistance systems (ADASs), and energy-saving electronic devices, amid the new social infrastructure that is being built, we will contribute to the development of the semiconductor and information communication industries by expanding and upgrading our lineup of high heat-dissipation fillers that meet customer needs.