Products
Boron nitride
Hexagonal Boron Nitride (h-BN) has excellent properties, such as high thermal conductivity, high insulation resistivity, high water resistance as a nitride and low dielectric constant. h-BN filler is suited to high thermal conductive applications for resin composite such as Thermal Interface Material (TIM), metal based substrate and so on. Tokuyama developed low and high aspect ratio primary h-BN particles and agglomerated h-BN filler. High aspect ratio primary h-BN particles is suitable for cosmetics and mold release. Viscosity of epoxy resin filled with low aspect ratio primary h-BN particles was lower than high aspect ratio primary h-BN particles. The agglomerated h-BN filler has particularly excellent thermal conductivity characteristics, which greatly contributes to increasing the thermal conductivity of the heat dissipation substrate.
Product overview *Some products under development
| Generic names | Boron nitride |
|---|---|
| Chemical formula | BN |
| Packing / shipping method |
PE bag(5kg) |
| General applications | High thermal conductivity filler, mold release, cosmetics, etc |
Special characteristics
- High-purity, particle-size, and shape-controlled boron nitride powder suitable for electronic material applications
- Thicker single particles that can be highly filled (S03)
- Large particle size agglomerated particles (DF-20) that can be applied to heat dissipation sheets of 15 W/m·K or more
- Flake single particles (K03) applicable to cosmetics and release agents
*Values are representative, not guaranteed.
K03
S03
DF-20
