Tokuyama's high-purity aluminum nitride powder exhibits excellent thermal conductivity, a high rate of electrical insulation, and thermal expansion properties similar to various kinds of semiconductors, making it an optimum material for sintered bodies. By adding an auxiliary agent for sintering to this high-purity aluminum nitride powder, Tokuyama also offers high-purity aluminum nitride granules that are shaped to be easily handled.
Material for sintered bodies; material for sialon compound; various kinds of additives
Special characteristics of the powder form
Highly pure micro powder with an extremely small amount of metallic impurities.
Extremely low oxygen content makes it suitable as a raw material for sintered bodies with excellent physical properties.
・Sharp particle size distribution
Mean diameter of agglomerated particles is about 1 micron, a sharp particle size distribution.
The primary particle diameter is about 0.6 microns, and the particle surface has been stabilized to realize greater stability than conventional products.
Excellent dispersion should result in improved heat dissipation as resin filler.
・High sinter ability
Possesses a high degree of sintering.
The powder enables translucent sintered bodies to be produced via hot pressing and pressureless sintering.
Specific Surface Area
Mean Particle Size
* Above values are typical and not for specification.
The strength of Tokuyama's Thermal Management Material Business
Tokuyama develops products to suit specific applications, including aluminum nitride(AlN) powder, AlN granules, and SHAPAL ceramics made by sintering sintering AlN powder. By applying the Company's internally developed manufacturing methods and the nitride reduction process, Tokuyama produces high-quality AlN related products with an extremely low amount of impurities. With those production capabilities, We manufactures 840 metric tons of aluminum nitride products annually—the world's largest production capacity. Furthermore, Tokuyama has risen to prominence as a leading company in the industry with a 75% share of the global market for aluminum nitride powder.
Aluminium Nitride overview
A compound of aluminum and nitrogen, aluminum nitride(AlN) is a highly functional material with a high rate of thermal conductivity and electrical insulating properties strong enough to prevent electricity from passing through. AlN is primarily used as heat-dissipation materials for electronic components that perform unstably when heated, such as semiconductors. These applications cover a wide range of products, including semiconductor production equipment parts, inverters for industrial machinery, IGBT substrates for trains and automobiles, and various environment- and energy-related products. In recent years, SHAPAL aluminum nitride ceramics are attracting special attention as a material for LED heat-dissipating substrates, which are generating high hopes for their potential to save energy.
1. High thermal conductivity (about 10 times that of alumina)
2. Close thermal expansion coeffi cient to that of Sillicon (Si)
3. High insulation
4. High mechanical strength (higher than alumina)
5. High corrosion resistance (non wetted by most moiten metals)
6. High purity (does not contaminate moiten metal even at a high temperature)
7. Transparency (allows visible to infared light to pass through easily)
8. High halogen-plasma resistance
Comparison of performance between Aluminum Nitride and other materials for substrate