Aluminum nitride filler

The new aluminum nitride filler synthesized by Tokuyama's proprietary technology has excellent fluidity in addition to high thermal conductivity and insulation, and achieves high filling to resin to realize its high thermal conductivity improvement.

The new aluminum nitride filler

Properties and application fields of aluminum nitride

Aluminum nitride is an inorganic material having both high thermal conductivity and insulating properties. It has the almost same thermal expansion coefficient as silicon semiconductor and has resistance to halogen gas plasma used in semiconductor manufacturing process. Utilizing its characteristics, it is used for components for semiconductor manufacturing equipment in silicon wafer front-end process, or electrical insulating heat dissipation substrate for power semiconductors and high power LEDs. Since it has about 9 times thermal conductivity compared with conventional heat dissipating material, it is expected as a high heat dissipation filler which improves the thermal conductivity of resin

Characteristics of various ceramics materials

Scroll table PDF

  AlN Al2O3 BN Si3N4 SiC
Density
(g/cm3
3.3 3.9 2.3 3.2 3.2
Thermal conductivity
(W/m・k)
170 20 60 90 270
Thermal expansion coefficient
(10-6K)
4.4 7.3 2.8 3.0 3.7
Bending strength
(MPa)
500 450 40 800 450
Fracture toughness
(MPa・m1/2
2 4 - 6 4
Dielectric constant
(-)
8.8 8.5 4.5 9.0 40
Dielectric loss
(×10-4@1MHz)
3 3 9 3 500
Volume resistivity
(Ω・cm)
>1014 >1014 >1014 1014 102
Dielectric strength
(kV・mm-1
20 20 20 10 <1

Grade and powder characteristics of aluminum nitride filler

Aluminum nitride fillers with various particle sizes are required to fill the resin with a high load. In general, it is effective to blend and fill about three kinds of large, medium and small particles in reasonable formulation to fill. Also, the size of the largest filler is determined based onby the thickness of the resin. We are developing aluminum nitride fillers with various sizes. We propose combination of sizes and compounding according to customer's needs.

The thermal conductivity of resin filled with aluminum nitride filler

When filling aluminum nitride filler in epoxy resin, thermal conductivity is greatly improved by increasing filling amount of filler. When several kinds of aluminum nitride filler are blended and filled at 80 vol%, the thermal conductivity becomes 12 W / mK and it shows about 60 times the thermal conductivity of epoxy resin alone.

Thermal conductivity when aluminum nitride filler is filled in epoxy resin

Thermal conductivity when aluminum nitride filler is filled in epoxy resin

Flowability and softness of resin filled with aluminum nitride filler

Tokuyama's newly developed aluminum nitride filler has lower viscosity than conventional aluminum nitride filler because of its particle shape, surface smoothness and monodispersed size. As a result, it not only realizes easy mixing and higher filling of filler, but also improves the softness of the silicone resin with higher filling of the aluminum nitride filler. Furthermore, in response to customers' requests, we are also developing a grade with surface treatment that improves the ease of mixing with resins.

Comparison of viscosity of aluminum nitride filler

Comparison of viscosity of aluminum nitride filler

Softness when adding aluminum nitride filler to silicone resin at 84vol%

Softness when adding aluminum nitride filler to silicone resin at 84vol%

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