Silicone fine particle "SANSIL™MP-01"

SANSIL™ MP-01 consists of approximately 100 nm spherical polymethylsilsesquioxane particles, featuring a three-dimensional network structure represented by (CH3SiO3/2)n.
This structure exhibits a hybrid nature between inorganic and organic materials, with one methyl group bonded to each silicon atom.
As a result, SANSIL™ MP-01 offers lower specific gravity and greater flexibility compared to silica. Additionally, the particle surface is functionalized with trimethylsilyl groups, providing excellent hydrophobicity.

Structural Image

Structural Formula ImageIt is softer than inorganic particles such as silica.

Features

  • Heat resistance
  • High dispersibility
  • Lubricity
  • Flexibility

Applications

  • Toners
  • Films
  • Paints and Coatings
  • Rubbers

Basic Physical Properties

Excellent Heat Resistance

Even when heated up to 1000℃, the weight loss is approximately 15%.

Related Material

R&D Theme

Inquiries Concerning Developed products

Silica & Derivatives Sales Dept.